
Assembly and packaging comprises a complex technology which aims at the fabrication of electronic hardware. This technology is mainly based on Materials Science and Engineering, Mechanical and Electrical Engineering. The target is to connect a functional element to an application and at the same time to protect it from the environment. Fabrication technologies comprise assembly, joining and interconnection, while the main constructional elements are substrates, housings or packages. For all of these present days' state of the art is presented and the fundamental requirements are demonstrated. So the students will get an overview of the basic manufacturing operations and the required materials in order to integrate electronic hardware. Besides, it is indispensable that knowledge about modern techniques for design optimization will be taught. Electronic systems must fulfill specifications concerning integration density, high frequency behaviour, thermal management, thermal-mechanical behavior and lifetime. To that purpose, the basic techniques for performance and reliability optimization will be regarded. In this way, it is desired that the students will become capable of finding own solutions in the field of assembly and packaging of microsystems. The course comprises the following’s:
- Housing and packaging technologies Hermetic and plastic packaging, wafer-level packaging
- Substrates Printed circuit boards, multi-chip-modules, molded interconnect devices
- Assembly technologies Surface mount technology, adhesive bonding
- Interconnection technology Wire bonding, flip-chip-bonding
- Electromagnetic compatibility EMC Integrity and speed of electrical signals and equivalent circuits
- Thermal management Temperature problems and cooling techniques
- Mechanical optimization Stress-affected problems, solder joint reliability
The key required for accessing the course is:
asptech2
- Trainer/in: Andreas Goralczyk
- Trainer/in: Peilong Hou
- Trainer/in: Bastian Rapp







